China Claims New 14nm AI Chip Matches Nvidia 4nm Performance Through 3D Hybrid Bonding
Summary
China's semiconductor industry claims a breakthrough 14nm AI chip achieves performance equivalent to Nvidia's advanced 4nm processors through innovative 3D hybrid bonding technology, potentially circumventing U.S. export restrictions while delivering 120 TFLOPS throughput and challenging American dominance in AI hardware.
Key Points
- China Semiconductor Industry Association vice chairman Wei Shaojun claims a new domestically designed AI processor using 14nm logic and 18nm DRAM nodes can match performance of Nvidia's 4nm chips through 3D hybrid bonding technology
- The architecture achieves claimed power efficiency of 2 TFLOPS per watt with total throughput of 120 TFLOPS by placing memory and logic in the same package to avoid the 'memory wall' that limits GPU performance
- Wei positions this development as part of China's strategy to break dependence on Nvidia's CUDA ecosystem and build a domestic AI technology stack resilient to U.S. export controls and supply chain restrictions