Samsung and AMD Sign Deal for Next-Gen HBM4 Memory Chips Powering AI Data Centers

Mar 19, 2026
Bloomberg.com
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Summary

Samsung and AMD sign a landmark deal making Samsung the primary supplier of next-gen HBM4 high-bandwidth memory chips for AMD's MI455X AI accelerators, deepening their alliance in the rapidly growing AI data center market.

Key Points

  • Samsung Electronics and Advanced Micro Devices have signed a preliminary agreement for Samsung to supply next-generation HBM4 high-bandwidth memory chips to AMD.
  • Samsung is set to serve as the primary HBM4 supplier for AMD's MI455X accelerators, which are designed for use in corporate data centers.
  • The partnership also extends to collaboration on next-generation AI memory and computing technologies, signaling a deepening alliance between the two tech giants.

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