Meta and Broadcom Join Forces to Co-Develop Next-Gen AI Chips in Multi-Gigawatt Silicon Rollout
Summary
Meta and Broadcom are joining forces to co-develop next-generation custom AI chips, committing to a massive multi-gigawatt silicon rollout to power AI across Meta's platforms, as Broadcom CEO Hock Tan steps down from Meta's board to serve as a strategic advisor on its chip roadmap.
Key Points
- Meta and Broadcom are partnering to co-develop multiple generations of custom AI silicon, including next-generation MTIA chips designed to power AI across Meta's apps and services.
- The partnership covers chip design, advanced packaging, and networking, with an initial commitment exceeding 1 gigawatt of custom silicon deployment as the first phase of a planned multi-gigawatt rollout.
- Broadcom CEO Hock Tan is stepping down from Meta's Board of Directors and transitioning to an advisor role, where he will provide guidance on Meta's custom silicon roadmap and infrastructure investments.